Physical Vapor Deposition Market Drivers and Market Restraints
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Physical vapour deposition (PVD) is also known as physical vapour transfer (PVT), and it is a type of vacuum deposition procedure used to make thin films and coatings. Materials are transported from condensed to vapour phases and then returned to the condensed phase of thin films in this process. PVD is utilised in a variety of applications, including microelectronic device production, surface modifications, battery and fuel cell electrodes, interconnects, diffusion barriers, and optical and conductive coatings. In practically all industries, thermal evaporation, sputtering, and ion plating are the three most used physical vapour deposition methods.
Drivers
The physical
vapour deposition market is primarily driven by the increasing
penetration of microelectronics across numerous industries. Microelectronics is
a technology that produces small electronic devices that are measured in
micrometres and has applications in the automotive, defence, and healthcare
industries. One of the most common applications for physical vapour deposition
is microelectronics (PVD). As a result, the growth of the microelectronics
market fuels the growth of the physical vapour deposition market.
Physical
vapour deposition's increasing use in the manufacturing of low-e glass for the
construction and automotive industries is expected to boost market growth.
Aluminum and aluminium alloys, silver, copper and copper alloys, and chromium are
some of the PVD materials used to coat low-e glass. Low-e glass helps to reduce
heat loss, which is becoming increasingly important in the construction
industry. As a result, increased demand for low-E glass from the construction
industry is likely to drive physical vapour deposition market growth.
Physical vapor deposition Market
Market Restraints
Physical
vapour deposition's market growth is likely to be constrained by high capital
expenditure and a lack of product differentiation and innovation. Physical
vapour deposition technology's market expansion is projected to be hampered by
the high cost of investment required to develop new and advanced product
development technology.
The market
is projected to be hampered by a lack of qualified workers and a line of sight
method, as physical vapour deposition technology requires both. Furthermore,
because the coating surface is exposed to extremely high temperatures, parts
used for coating require high-strength electroplated coatings to defend against
corrosion, which is difficult to acquire. Over the projected period, this issue
is expected to limit the market growth of physical vapour deposition.
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